Solder Stories

Sn-Bi eutectic solder paste has low soldering temperature requirements and can be soldered at low temperatures. This solder paste is important in the solder market due to its advantages, such as low-temperature soldering and high tensile strength. However, Bi is a brittle metal and prone to segregation in the solder during the heating process. The localized Bi phase segregation and coarsening causing solder joint brittleness affect the application of Sn-Bi eutectic solder paste. Fortunately, adding some particles to Sn-Bi eutectic solder can enhance the solder strength.

Tin whiskers are slender, needle-shaped tin whiskers that form spontaneously on the surface of pure tin (Sn) or of a tin-containing alloy. These whiskers are usually only a few micrometers in diameter, but can be several millimeters long or even more than 10 millimeters long, which can cause serious reliability problems. The following is a comprehensive explanation of tin whisker growth mechanism, influencing factors and inhibition measures:

In the surface assembly process of electronic products, especially in the high-volume reflow soldering process, the tombstone effect of passive chip components to the PCBA assembly soldering adds a lot of trouble.

After her husband is deployed for three years and its his last deployment, lily goes through a lot before her husband comes back, including the birth of the quadruplets and his parents forbidding Lily from visiting them.

With the development of the package size in semiconductor packaging to below ten nanometers, Moore's Law has reached its limit. Manufacturers developed a technology to realize semiconductor chip integration with a smaller chip size. The application of SiP is to integrate multiple microchips under Moore's Law limit conditions through multi-material and multi-dimensional space integration, thereby expanding the function of the chip and making an integrated chip combination to achieve the sensor and control chip packaging of 5G, IoT, etc. Once the chips are integrated and packaged, it is necessary to use BGA packaging to connect the electrical signals of each chip to the substrate PCB, COB, FPC, etc. Since these connection point sizes are below 100μm, the original 0.1mm and 0.2mm BGA balls can no longer meet the micro-connection requirements.

Soldering mobile phone motherboards requires the selection of solder paste suitable for high-density, fine solder joints, and the following are key factors and recommendations:

Tin whisker growth has been a major concern in electronics manufacturing.At room temperature, thin, sharp whiskers often appear on the surface of tin coatings, which not only affect the appearance of the product, but can also cause short circuits and lead to equipment failure.In this paper, we will discuss the growth characteristics of room temperature tin whiskers, analyse the differences in their performance on different substrate materials, and propose effective prevention and control strategies.

it is well known that 60-70% of all solder defects can be traced back to the printing defects such as solder bridging, cold slump and Uneven Solder Paste Deposit while fine tuning the reflow profile do benefit and avoid some soldering defects

Katie was always bullied constantly by he bullies: Jake, Danny, Charlie, and Mitch till she meets Max who is a new kid at her school. Read how he helps her through tough times.

The flip chip assembly process typically includes soldering, flux residue removal and underfill. As chips continue to miniaturize, the gap between the flip chip and the substrate decreases, making it increasingly difficult to remove flux residue.

Solder paste (solder paste) is a commonly used material in the electronic assembly process, and its storage and use methods are critical to ensuring soldering quality and performance. The following are the detailed storage and usage methods:

Solder paste not adhering to the pad is a common problem in electronic soldering, usually caused by oxidation, contamination, insufficient temperature or solder/flux problems. The following are the detailed troubleshooting and solutions: