Истории Solder

SAC series solder paste is a common medium-temperature solder in semiconductor packaging. This type of solder paste can be used for soldering work at relatively high temperatures, and the strength after soldering is considerable.

Solder paste is a key material in electronic soldering, mainly composed of the following three parts:

In order to protect human health and safety and to improve the environmental performance of electronic equipment, the European Union adopted the Restriction of Hazardous Substances (RoHS) Directive in 2006,

Surface mount technology (SMT) and through-hole insert technology (THT) are the two main methods for mounting electronic components on printed circuit boards (PCBS). While they all play an important role in electronics manufacturing, there are significant differences in technology and application.

The widely used solder paste brands in China include both internationally renowned brands and excellent local manufacturers.The following is a classification of common brands and their characteristics:

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Non Wet Open (NWO) refers to the PCB (Printed Circuit Board), BGA (Ball Grid Array) pads do not achieve a good wet open solder joints.Typical characteristics of its slicing diagram for all or part of the PCB pads on the lack of solder wetting, as shown in Figure 1-1 (not attached here, but a clear description).

In microelectronics and semiconductor packaging, the most basic purpose of pad surface treatment is to ensure good solderability and conductivity of the pads.

There are significant differences between BGA flux paste and ordinary flux paste, mainly in the following aspects:

Bridging in QFN packages is particularly common between the inner rows of solder joints in double-row QFNs, and relatively rare in single-row QFNs.Bridging occurs when solder is pressed against a non-wetted surface, which usually results in an electrical short that can seriously affect the performance and reliability of a circuit.As shown in the figure below.

One of the causes of thermomigration is the inconsistent internal temperature of the alloy. When heat treating a uniform binary alloy, due to the temperature difference between one end and the other end of the alloy, metal atoms will migrate, and the alloy will become uneven.

Tin whiskers are slender, needle-shaped tin whiskers that form spontaneously on the surface of pure tin (Sn) or of a tin-containing alloy. These whiskers are usually only a few micrometers in diameter, but can be several millimeters long or even more than 10 millimeters long, which can cause serious reliability problems. The following is a comprehensive explanation of tin whisker growth mechanism, influencing factors and inhibition measures: