Solder قصص

Sn-Bi eutectic solder paste has low soldering temperature requirements and can be soldered at low temperatures. This solder paste is important in the solder market due to its advantages, such as low-temperature soldering and high tensile strength. However, Bi is a brittle metal and prone to segregation in the solder during the heating process. The localized Bi phase segregation and coarsening causing solder joint brittleness affect the application of Sn-Bi eutectic solder paste. Fortunately, adding some particles to Sn-Bi eutectic solder can enhance the solder strength.

With the advent of the post-Moore era, electronic components are gradually developing in the direction of miniaturization, complex structure, and functional integration. Laser soldering has become popular for improving soldering processes with its unique advantages of non-contact, selective local heating, and high precision. What we know is that laser soldering can solve the problems of difficulty in improving precision and the high cost of small batch production in traditional reflow soldering. Since intermetallic compounds play a vital role in the reliability of solder joints, researchers are eager to discover the impact of laser soldering on the evolution of intermetallic compounds in solder joints.

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One of the causes of thermomigration is the inconsistent internal temperature of the alloy. When heat treating a uniform binary alloy, due to the temperature difference between one end and the other end of the alloy, metal atoms will migrate, and the alloy will become uneven.

As an extremely important part of solder paste products, flux affects important properties such as the performance and reliability of solder paste. The base material is one of the main components of the solder paste flux. What are the functions of the base material in the solder paste flux? What are the commonly used base materials of the flux? How does it work?

it is well known that 60-70% of all solder defects can be traced back to the printing defects such as solder bridging, cold slump and Uneven Solder Paste Deposit while fine tuning the reflow profile do benefit and avoid some soldering defects

Four Kingdoms they started with. The North and the South were at peace, the East was in the midst of a possible civil war and the West was in the process of rebuilding what they had lost from an attack from one of the desert lands. As the Southern kingdom’s King abdicate the throne, a new ruler was making himself known to the people of the kingdom. Holding their trust in his hands, he was about to make the world fall on their knees. But one person stood in the way of his success: a young general, Shirogane Kusakawa, who was known for his stubbornness and intelligence, maybe a threat. Now he wants to get rid of Shirogane…for good. [On Hold]

Solder paste soldering tin splattering refers to the soldering process, high temperature soldering iron tip contact solder paste, solder paste instantly produce a violent reaction, issued by the explosion sound and splattered small tin beads of the phenomenon. The following are the main reasons for tin splattering and solutions:

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Laser solder paste technology, as an advanced means of soldering, has shown significant advantages in the field of electronics manufacturing.Its principle and advantages are detailed below:

Fluxes and flux pastes both play an important role in the soldering process, but there are some distinct differences in their composition, use, form, and application scenarios.

There is a strong link between the microstructure and the mechanical properties of the solder joints, such as the cooling rate, creep and fatigue properties, as well as the lead-free alloy properties have a large impact on the solder joint properties. The following are some analyses and further explanations:

Definition：Lead-free solder paste has developed rapidly as an alternative to leaded solder paste. EU's RoHS ISO9453 and Japan's JEIDA stipulate that solder alloys with Pb content less than 0.1wt% (1000ppm) can be defined as lead-free solder alloys.

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Tin whisker growth has been a major concern in electronics manufacturing.At room temperature, thin, sharp whiskers often appear on the surface of tin coatings, which not only affect the appearance of the product, but can also cause short circuits and lead to equipment failure.In this paper, we will discuss the growth characteristics of room temperature tin whiskers, analyse the differences in their performance on different substrate materials, and propose effective prevention and control strategies.

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