
#1
overwatch X Reader Oneshotsby mel
I may do requests, but really I'm making this just to put the ideas I have down for it. (No NSFW!)

#2
Steele Promisesby Nonnie
When Preston left Chey behind in the group home he promised to always look out for her. So when she finds herself in more trouble than she can handle on her own she know...
Completed

#3
Winter and Warby Sammy
When Rhodey wakes up in Tony's living room, he's confused when he see's a total stranger in the kitchen. One who has a metal arm that's apparently not made by Tony Stark...
Completed

#4
LGA device soldering failure analy...by pd5213344
LGA (Land Grid Array) is the use of the device body pad as the solder side of the components, under the BTC device, and QFN similar. LGA has no pins and solder balls, an...

#5
How the price of solder paste is c...by pd5213344
The price of solder paste is indeed calculated in a variety of ways, based on a number of factors such as purchase volume, usage, recycling and special customisation nee...

#6
What Kind of Solder Paste is Selec...by pd5213344
In recent years, flip-chip technology has been increasingly adopted in consumer electronics and high-performance products. During flip-chip packaging, lead-free solder p...

#7
Global Solder Resist Ink Market Gr...by
The global market for solder resist will grow at a CAGR of 6.18% by 2022, according to a new report published by Gen Consulting Company. The report segments the market a...

#8
Tin whisker phenomenon in electron...by pd5213344
Tin whiskers are slender, needle-shaped tin whiskers that form spontaneously on the surface of pure tin (Sn) or of a tin-containing alloy. These whiskers are usually onl...

#9
From odd neighbors to odd familyby Gray Grayson
In a modern day world where tf2 is real and the mercs not only live in a house off base but are still as chaotic and old fashioned as ever they find themselves looking o...

#10
High-Temperature solder on Flip Ch...by pd5213344
Flip-chip interconnection technology has been widely used in high-performance and consumer electronics. High-performance packaging has achieved steady development, reali...

#11
The Evolution of Intermetallic Com...by pd5213344
With the advent of the post-Moore era, electronic components are gradually developing in the direction of miniaturization, complex structure, and functional integration...

#12
Thermomigration of Solder Jointsby pd5213344
One of the causes of thermomigration is the inconsistent internal temperature of the alloy. When heat treating a uniform binary alloy, due to the temperature difference...

#13
Difference between flux and solder...by pd5213344
Fluxes and flux pastes both play an important role in the soldering process, but there are some distinct differences in their composition, use, form, and application sce...