Key Points of Formulation Design of the Heat Resistant Epoxy Glue

Main factors affecting the temperature resistance of epoxy adhesive

The high temperature property of epoxy adhesive depends on the thermal deformation temperature and thermal oxidation stability of the cured product. The former determines the mechanical properties (strength, modulus, creep, etc.) at high temperatures, and the latter determines the ultimate service temperature (decomposition temperature). These all depend on the molecular structure and mutual reactivity of resin and curing agent. Generally speaking, the shorter the distance between the crosslinking points in the solidified product is, the higher the crosslinking density will be. The more heat-resistant rigid groups such as aromatic rings, alicyclic rings and heterocyclic rings on the molecular chain, the higher the thermal deformation temperature, the higher the high-temperature mechanical properties, the better the heat resistance, but the greater the brittleness will be. Brittleness will reduce the strength, so toughening is usually needed. Thermal oxidation stability refers to the ability of the solidified product to resist thermal oxidation damage. It is related to the chemical structure of the solidified product. It can be improved by adding antioxidants.
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