THE MANUFACTURING PROCESS OF SAPPHIRE WAFER

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Sapphire wafer manufacturing process:
1. Orientation: Accurately locate the sapphire crystal rod position on the slicing machine, so as to facilitate precise slicing processing
2. Slicing: Cut the sapphire crystal rod into thin wafers
3. Grinding: Remove the chip cutting damage layer caused by slicing and improve the flatness of the wafer
4. Chamfering: Trim the wafer edge into a circular arc to improve the mechanical strength of the wafer edge to avoid the defects caused by stress concentration
5. Polishing: Improve the roughness of the wafer to reach the epitaxial wafer's precision
6. Cleaning: Remove the contaminants on the wafer surface (such as dust particles, metals, organic contaminants)