TSMC 3DFrabric Technology used in Apple Chip-to-Chip Connection
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Ongoing, First published May 02, 2022
In June 2021 Patently Apple posted a report named "TSMC's 3DFabric Technology is the following enormous wave in Chip Design that Apple will exploit not long from now." While TSMC 3DFabric didn't initially make a big appearance on an iPhone, another Tom's Hardware report expresses that TSMC has explained that Apple's UltraFusion chip-to-chip interconnect does. 

Read More: https://technewsrooms.com/2022/05/02/apple-chip-to-chip-tsmc-technology/
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