The Application of Solder to Produce Micro-Bumps in SiP

With the development of the package size in semiconductor packaging to below ten nanometers, Moore's Law has reached its limit. Manufacturers developed a technology to realize semiconductor chip integration with a smaller chip size. The application of SiP is to integrate multiple microchips under Moore's Law limit conditions through multi-material and multi-dimensional space integration, thereby expanding the function of the chip and making an integrated chip combination to achieve the sensor and control chip packaging of 5G, IoT, etc. Once the chips are integrated and packaged, it is necessary to use BGA packaging to connect the electrical signals of each chip to the substrate PCB, COB, FPC, etc. Since these connection point sizes are below 100μm, the original 0.1mm and 0.2mm BGA balls can no longer meet the micro-connection requirements.