Analyzing SAC305 solder paste and its function

SAC305 solder paste is a lead-free solder, specially developed to adapt to the environmental requirements and meet the RoHS and REACH requirements of the European Union. It is mainly composed of tin-silver-copper alloy (containing 96.5% tin, 3% silver and 0.5% copper) and flux, the melting temperature of the alloy is 217 degrees Celsius, and it is recommended for lead-free soldering by JEIDA (Japan Electronics Industry Development Association).