Wafer Back Grinding Wheel
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  • Parts 1
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  • Reads 2
  • Votes 0
  • Parts 1
  • Time <5 mins
Ongoing, First published Aug 09, 2024
https://www.egrindwheel.com/products/wafer-back-grinding-wheel/

E-Grind wafer back grinding wheel have developed the technology to combine diamond and bond to meet your requirements. Especially our advanced porosity technology makes it possible to grind all types of wafers with less bug-surface damage. E-Grind Wafer Back Grinding Wheel use a special vitrified bond for rough grinding or a resin bond for fine finishing and improved process accuracy. The wafer grinding wheel features free cutting, excellent wear resistance, and good shape maintainability for long durability.

Performance of Wafer Back Grinding Wheel
E-grind wafer grinding wheel incorporates leading technology, providing advanced solutions for precision grinding tasks.

The wafer back grinding wheel exhibits good self-sharpening capabilities, ensuring consistent performance and longevity without frequent maintenance.

This wafer grinding wheel requires no dressing, which simplifies the grinding process and reduces operational downtime.
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Emmy's life is going just as she'd planned: She's living in her own apartment, dancing every day and is just leaps away from being named her company's next Prima ballerina. And she's only 17. But all of Emmy's plans come to a screeching halt when the FBI shows up at her door to let her know that she's being stalked by a serial killer. Suddenly, the safe, insulated world she created for herself is riddled with violence, fear...and a growing pile of dead bodies. At first Emmy wants nothing more than to forget her chilling new reality - but her admirer isn't finished with her yet, and before she knows it, Emmy's stuck in a nightmare she can't dance her way out of. Content and/or trigger warning: This story contains detailed scenes of murder, rape, torture, sex and stalking, which may be triggering for some readers. [[word count: 80,000-90,000 words]]