What Kind of Solder Paste is Selected for Flip Chip Package?
pd5213344
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  • Reads 3
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  • Time <5 mins
pd5213344
Ongoing, First published Sep 24, 2024
solder
In recent years, flip-chip technology has been increasingly adopted in consumer electronics and high-performance products. During flip-chip packaging, lead-free solder paste can be used for substrate bumping, modules, and board level connections, etc. What kind of lead-free solder paste should be selected in practical applications?
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