Silicon Wafer Grinding/Polishing Colloidal Silica

https://www.polishingslurry.com/products/silicon-wafer-polishing-slurry/

Kona Silicon Wafer Polishing Colloidal Silica has developed for silicon wafer rough and final polishing process. During CMP of silicon substrate, Kona slurry obtain a super-smooth surface, and help you to cost down.

Silicon Wafer Polishing Slurry Features

Kona provides a series of lapping &polishing powders and slurry for Silicon wafer lapping、rough polishing and final polishing, used in the chemical mechanical planarization process of Silicon wafer.

We offer colloidal silica for silicon wafer final polishing process, which can be used in both single-side and double-side polishing.

We developed nano alkaline colloidal silica for chemical mechanical polishing( CMP )of silicon wafers, which has good dispersity and stability, enhances the material removal rate(MRR), and improved the surface roughness (Ra/Rz).

We have the ability to develop suitable polishing slurry to meet the customer's needs in semiconductor manufacturing.