- Reads 0
- Votes 0
- Parts 1
- Time <5 mins
Ongoing, First published Oct 15, 2024
The wetting reaction of a lead-free eutectic solder to a metallised layer under a thick Cu bump involves a number of aspects, and the following is a detailed analysis of the process:All Rights Reserved
Sign up to add solder to your library and receive updates
or
You may also like
You may also like
