How to set the conditions for acceptable solder paste printing graphics?
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  • Reads 3
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  • Parts 1
  • Time <5 mins
Ongoing, First published Nov 12, 2024
Fine-pitch components (e.g. QFN, BGA, etc.) have extremely high requirements for solder paste uniformity, thickness and edge definition due to their small pin spacing. Any minor printing defects can lead to poor soldering, such as bridging, open circuits or empty soldering. Therefore, these special requirements must be fully taken into account when setting acceptable conditions.
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