High-Temperature solder on Flip Chips and Low-Temperature Solder Paste
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Ongoing, First published Nov 29, 2024
Flip-chip interconnection technology has been widely used in high-performance and consumer electronics. High-performance packaging has achieved steady development, realizing the interconnection with more than 10,000 I/Os and a pitch of less than 200um, realizing the transition from ceramic substrates to low-cost organic substrates, and achieving the popularization of lead-free solder pastes. The transition to organic substrates has prompted low-temperature solder pastes to replace high-temperature solder pastes.
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