Analysis of QFN package bridging phenomenon and suggestions for improvement
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Ongoing, First published Dec 27, 2024
Bridging in QFN packages is particularly common between the inner rows of solder joints in double-row QFNs, and relatively rare in single-row QFNs.Bridging occurs when solder is pressed against a non-wetted surface, which usually results in an electrical short that can seriously affect the performance and reliability of a circuit.As shown in the figure below.
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