Soldes Stories

SAC305 is a common medium-high-temperature solder commonly used in secondary reflow soldering. SAC305 has high conductivity and soldering strength, which can meet the usage requirements of most microelectronic products. The main factor affecting the soldering strength of SAC305 is the growth of intermetallic compounds (IMCs). IMCs nucleate and grow due to interface reactions during soldering and aging, and their brittleness may reduce the strength of the solder joints. SiC is a ceramic material with unique chemical stability and ultra-high melting point and possesses excellent electrical, mechanical, and thermal properties. Many studies have shown that SiC particles can be refined β- Sn and IMCs play a role in enhancing solder joints.