The without hub is a kind of ultra-thin and precision with excellent cutting ability, good rigidity, and high efficiency. It fits to be used for dicing and slitting of many materials, such as semiconductors, electronic components, ceramics, etc.
Performance of Without Hub
Strong cutting ability
High accuracy
The thinnest wheel is 0.015mm, thickness tolerance is ±0.002mm
Applications of Without Hub
For dicing BGA, Alumina, TiC, Ferrite, LTCC, and other materials.
E grind, as an excellent , offers a wide range of for you to choose from.
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Dicing Blades Without Hub
Adventurehttps://www.egrindwheel.com/products/dicing-blades-without-hub/ The wafer dicing blade without hub is a kind of ultra-thin and precision diamond dicing blades with excellent cutting ability, good rigidity, and high efficiency. It fits to be used f...