Solder Stories

Solder Paste and Ultra-Fine Solder Manufacturer-Shenzhen Fitech is a comprehensive solder paste supplier integrating production, sales, research, and service of solder p...

There are various methods of solder paste viscosity testing, each with its own specific scope of application, advantages and disadvantages.Below is an overview of severa...

Laser solder paste technology, as an advanced means of soldering, has shown significant advantages in the field of electronics manufacturing.Its principle and advantages...

The price of solder paste is indeed calculated in a variety of ways, based on a number of factors such as purchase volume, usage, recycling and special customisation nee...

Wafer microbumping packaging, more commonly expressed as Wafer Microbumping or Wafer Bumping, is an advanced semiconductor packaging technology.The following is a detail...

Conductive adhesive, an adhesive that exhibits specific conductive properties after curing or drying, its unique conductive properties and a wide range of application sc...

Bridging in QFN packages is particularly common between the inner rows of solder joints in double-row QFNs, and relatively rare in single-row QFNs.Bridging occurs when s...

There are various ways to prepare fine solder powder, and five commonly used methods are described below:

LGA (Land Grid Array) is the use of the device body pad as the solder side of the components, under the BTC device, and QFN similar. LGA has no pins and solder balls, an...

Fluxes do play a vital role in the manufacturing industry, especially in the electronics manufacturing industry.There are many of its well-known brands, each of which oc...

There are various methods of solder paste viscosity testing, each with its own specific scope of application, advantages and disadvantages.Below is an overview of severa...

Solder pastes can expire. The shelf life of solder pastes generally ranges from 6 months to 1 year, with finer ultra-micro solder pastes or epoxy pastes having a somewha...

There is a strong link between the microstructure and the mechanical properties of the solder joints, such as the cooling rate, creep and fatigue properties, as well as...

With the advent of the "post-Moore era", heterogeneous integration based on small chips will become the mainstream of semiconductor packaging. Small chips tend...

Flip-chip interconnection technology has been widely used in high-performance and consumer electronics. High-performance packaging has achieved steady development, reali...

With the advent of the post-Moore era, electronic components are gradually developing in the direction of miniaturization, complex structure, and functional integration...

In the electronic assembly process, dropped parts and solder balls are common quality problems, they have a direct impact on the reliability and performance of the produ...

Fine-pitch components (e.g. QFN, BGA, etc.) have extremely high requirements for solder paste uniformity, thickness and edge definition due to their small pin spacing. A...

The phenomena of less tin and missed prints in the SMT (Surface Mount Technology) process are common quality problems, and they have an important impact on the quality a...

Lead-free soldering does present some solder joint reliability challenges relative to traditional lead (Pb) containing processes. This stems mainly from the differences...