Solder Stories

As the most prestigious annual event in the semiconductor industry across Southeast Asia, SEMICON SEA 2025 will take place at the Singapore Sands Convention and Exhibiti...

Non-wetting refers to the soldering process, the solder fails to adequately cover the surface of the substrate pads or device pins,

There are significant differences between BGA flux paste and ordinary flux paste, mainly in the following aspects:

Mini-LED direct display technology adopts COB (Chip on Board) package, which can achieve high density, high contrast and high brightness display effect.In the COB packag...

As an electronic soldering material, water-soluble solder paste has a series of obvious advantages over traditional organic solvent solder paste, but there are also some...

Void is the presence of air bubble in a solder joint, which affects the mechanical strength, thermal conductivity and electrical properties of the solder joint. Under th...

ntermetallic compounds are a class of substances formed by chemical bonding of metallic elements in specific atomic proportions.

Solder paste is a key material in electronic soldering, mainly composed of the following three parts:

The phenomenon of half-wetting, especially the similar behaviour of water on greasy surfaces observed during soldering, as shown in Figure 1-1, is indeed a complex and n...

Failure management after solder paste mixing is a key quality control aspect. The following is a detailed analysis and summary of failure management after solder paste m...

Tin whisker growth has been a major concern in electronics manufacturing.At room temperature, thin, sharp whiskers often appear on the surface of tin coatings, which not...

The problem of burrs and tarnish after solder paste soldering can be caused by a variety of factors, here are some specific solutions:

In the domestic solder paste market, many brands bloom, each with its own speciality.The following is an introduction to some well-known solder paste brands:

Solder leakage is an important part of electronic manufacturing, and its quality directly affects the subsequent soldering effect and product reliability.As a common pro...

To effectively reduce the cost of using solder paste, you can start from the following aspects:

Solder paste creeping tin for printing quality and soldering effect is critical.To improve the solder paste in the soldering process to climb the tin, you can start from...

There are significant differences between solid crystal solder paste and regular solder paste in several ways.The following is a detailed comparison of the two:

Sn-Bi eutectic solder paste has low soldering temperature requirements and can be soldered at low temperatures. This solder paste is important in the solder market due t...

SAC series solder paste is a common medium-temperature solder in semiconductor packaging. This type of solder paste can be used for soldering work at relatively high tem...

For mobile devices such as mobile phones, area array packages such as BGAs, CSPs or POPs are prone to drop failures and need to be reinforced when they are assembled ont...